THE NEW SOLUTION
SITEL TO APPLY THE HEAT
SINK THERMAL RADIATORTIP
THERMAL
INTERFACE
PASTEA new solution that reduces time and costs while ensuring high thermical performance
- No time for application of the heat-conducting support on pcb
- No cost for the die-cut (management and processing)
- Good thermal performance with reduced interfacial thermal resistance
- Homogeneous consistency of the deposit
- Homogeneous thermal interface between heat sources and heat sink
- It compensates differences in flatness between pcb and heat sink